Top Tech Jobs & Startup Jobs in Denver & Boulder, CO

Design and deliver high-performance flip-chip BGA ASIC packages addressing signal integrity, power integrity, thermal, reliability, and manufacturability. Perform physical layout, manage multiple projects, interface with customers and vendors, and improve design processes and automation.

Develop, characterize, and sustain photolithography processes for high-volume Si MEMS production. Own photo processes and tools, manage SPC/overlay, lead experiments and data analysis, troubleshoot yield/defect issues, and drive long-term process improvement with Equipment Engineering and cross-functional teams.

The U.S. Payroll Analyst manages payroll inputs, accounting, auditing, payment processing, and reconciliations, ensuring compliance with regulations and collaborating with HR and external providers.

Design Engineer on Broadcom's Custom Silicon Design Team working on physical implementation of high-performance ASICs (3 nm and below). Responsibilities include floorplanning, placement, clock tree synthesis, routing, timing closure, physical verification, and signoff. Work in UNIX environments, use TCL (Python/Perl preferred) and commercial/in-house EDA tools, collaborate cross-functionally, and contribute to design flow automation and silicon bring-up. Requires Electrical/Electronics Engineering degree and strong VLSI/ASIC fundamentals.

Lead architecture and design of high-performance clocking solutions. Manage full lifecycle of analog timing IPs and validation, ensuring integration into SoCs.

The Verification Engineer will develop verification plans, maintain UVM-based testbenches, analyze simulations, and collaborate with teams to ensure design quality.

Design and deliver high-quality SystemVerilog RTL for advanced process nodes (5nm and below), optimize PPA, perform CDC/RDC analysis and low-power techniques, drive timing closure and hand off to physical design, and collaborate with Architecture, Verification, and Physical Design teams.

The role involves designing flip-chip-BGA packages for ASICs, collaborating on designs, managing projects, and improving processes.

Design and optimize mechanical aspects of ASIC packages using FEA. Collaborate with teams, conduct validations, and document designs across multiple projects.