Top Tech Jobs & Startup Jobs in Denver & Boulder, CO

10 Hours AgoSaved
Remote
United States
100K-500K Annually
Senior level
100K-500K Annually
Senior level
Hardware • Manufacturing
Lead as a hybrid Chief of Staff and execution-focused TPM for the RISC-V software org: define goals, plan and track execution, manage dependencies and risks, drive cross-functional initiatives, support headcount and recruiting, prepare leadership materials, and represent the team to partners and customers.
Top Skills: CompilersEngineering InfrastructureRisc-VSemiconductorsSoftware DeliverySystems Software
Reposted YesterdaySaved
In-Office
Fort Collins, CO, USA
100K-500K Annually
Senior level
100K-500K Annually
Senior level
Hardware • Manufacturing
The Staff Technical Program Manager will lead semiconductor physical design projects, managing complex schedules and facilitating communication between teams and clients within AI/ML and CPU initiatives.
Top Skills: Em/IrPhysical VerificationPlace And Route FlowsSynthesisTiming Analysis
Reposted YesterdaySaved
In-Office
Fort Collins, CO, USA
100K-500K Annually
Senior level
100K-500K Annually
Senior level
Hardware • Manufacturing
The STA Methodology Engineer will lead the optimization of timing methodologies and automation, collaborating across teams to address advanced-node design challenges.
Top Skills: Eda ToolsPerlPrimetimePythonTcl
3 Days AgoSaved
In-Office
Fort Collins, CO, USA
100K-500K Annually
Mid level
100K-500K Annually
Mid level
Hardware • Manufacturing
Lead cross-functional product development for AI processors and systems from concept to delivery. Drive schedules, risks, dependencies, and stakeholder alignment across hardware, software, firmware, validation, manufacturing, and suppliers. Communicate technical status to executives and coordinate structured product development processes in a hybrid, collaborative environment.
Top Skills: AICompilersFirmwareHardwareManufacturingNetworkingProcessorsRisc-VSemiconductorsSoftwareSystemsValidation
3 Days AgoSaved
Remote
United States
100K-500K Annually
Senior level
100K-500K Annually
Senior level
Hardware • Manufacturing
Design board-level routing studies, mock-ups, and SI/PI modeling to support early-stage semiconductor package and package-board co-design. Collaborate with signal integrity, power integrity, mechanical, and system teams to develop PCB routing environments for BGA optimization, package escape studies, and system-level electrical modeling. Apply engineering judgment to evaluate tradeoffs and improve workflows using automation and data analytics.
Top Skills: 2.5D PackagingBackside Power DeliveryBgaCadence Allegro Pcb DesignerChipletsIntegrated Voltage RegulatorsOff-Package MemoryOn-Package MemoryPackage Embedded PassivesPackage-Board Co-DesignPcb RoutingPower IntegritySignal Integrity
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6 Days AgoSaved
Remote
USA
100K-500K Annually
Expert/Leader
100K-500K Annually
Expert/Leader
Hardware • Manufacturing
Design and deliver die-to-die chiplet PHY IP in advanced FinFET nodes: develop PLLs and AMS blocks, lead design verification and layout interactions, support tape-out and silicon bring-up, and collaborate across architecture, digital, verification, layout, and software teams to achieve production-quality silicon.
Top Skills: AdcAmplifiersBias GeneratorsCtleDacDdrDe-EmphasisDfeDie-To-Die Chiplet PhyEda ToolsFinfetLdoOscillatorsPciePllRxSerdesSwitched-Cap CircuitsTxUsb
Reposted 6 Days AgoSaved
Remote
United States
100K-500K Annually
Mid level
100K-500K Annually
Mid level
Hardware • Manufacturing
Design and specify next-generation CPU networking for datacenter and automotive/robotics targets. Work at the intersection of NoC, performance modeling, and RTL to guide architecture, collaborate with hardware, software, and systems teams, and contribute to datacenter networking and early-stage automotive/robotics networking scoping and specifications.
Top Skills: Broadcom SueDie-To-Die InterfacesEthernetInfinibandNocNvlinkRdmaRisc-VRoceRtlUalink
Reposted 6 Days AgoSaved
Remote
United States
100K-500K Annually
Mid level
100K-500K Annually
Mid level
Hardware • Manufacturing
The CPU Core Unit Lead will develop next-generation CPU RTL, define microarchitecture specifications, oversee design quality, mentor junior engineers, and use AI tools to enhance design processes.
Top Skills: Ai ToolsRisc-VRtlVerilogVhdl
Reposted 6 Days AgoSaved
In-Office
Fort Collins, CO, USA
100K-500K Annually
Senior level
100K-500K Annually
Senior level
Hardware • Manufacturing
The Timing Engineer will perform static timing analysis, optimizing paths and constraints to ensure chip performance while collaborating with various engineering teams.
Top Skills: PerlPythonSpice ModelingSta ToolsTcl
Reposted 6 Days AgoSaved
In-Office
Fort Collins, CO, USA
100K-500K Annually
Senior level
100K-500K Annually
Senior level
Hardware • Manufacturing
Lead EM and IR-drop simulations ensuring robust power delivery and signal integrity for high-performance ICs. Collaborate with teams on power grid strategies and support EMIR sign-off across chip hierarchy.
Top Skills: PerlPythonRedhawkShellTclVoltus
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