The Staff Package Design Engineer will develop packaging solutions, collaborate with cross-functional teams, and ensure design rules are met while improving processes and efficiency in the design flow.
For over four decades, Cirrus Logic has been propelled by the top engineers in mixed-signal processing. Our rockstar team thrives on solving complex challenges with innovative end-user solutions for the world's top consumer brands. Cirrus Logic is also known for its award-winning culture, which was built on a foundation of inclusion and fairness, meaningful community engagement, and delivering enjoyable employee experiences at every turn. But we couldn’t do it without our extraordinary workforce – and that’s where you come in. Join our team and help us continue to make Cirrus Logic an exceptional place to grow your career!
Are you ready to make a significant impact in a fast-paced, innovative environment?
We are seeking a Staff Package Design Engineer to join our dynamic team in Austin, TX. In this role, you’ll work closely with internal and external customers to develop cutting-edge packaging solutions for high-performance products including amplifiers, codecs, and DSPs. Our packaging technologies span from traditional wire-bond QFN to advanced WLCSP and flip-chip designs.
Responsibilities
- Collaborate with cross-functional teams to drive package designs that meets Cirrus performance, reliability, and manufacturability requirements
- Define package requirements from electrical, thermal, and mechanical point of view in close cooperation with Design and layout teams
- Utilize AutoCAD, GDS tools, Siemen Fast3D and Cadence SiP Layout tool to complete physical design, electrical simulation and manufacturing validation solution for package design, including die bump array/BGA integration refinement using die information
- Drive continuous improvement processes to assure accuracy between the interface of the package to the die and PCB
- Work with cross functional teams (Customer, Designers, OSATs) to establish and maintain design rules for WLCSP, wire bond, and other packages
- Understand DFM checking and modification to improve assembly yield and prevent manufacturing issues
- Grow and promote automation processes throughout the package design flow
- Develop test vehicles that properly assess bump placement, PCB proximity effects, WLCSP RDL stack up and the like on final chip performance
- Close collaboration with customers to resolve various design issues between the piece part and PCB
Required Skills and Qualifications
- BS or above in Mechanical, Electrical, Chemical, or Materials Engineering
- 7+ years of experience in a package design engineering or related role
- Demonstrable experience in a packaging-related field
- Experienced Cadence SiP layout user
- Strong AutoCAD user
- Knowledge of packaging technologies, materials, package substrate design and assembly rules
- Understanding of electrical simulation results on a package design
- Familiarity or willingness to learn Cadence Virtuoso operation using Unix workstations
- Strong written and verbal communication skills; able to review technical ideas with customers and high-level management
- Self-starter with a strong sense of ownership and accountability for driving projects to completion
- Ability to build strong, influential relationships in a collaborative environment within a diverse setting
Preferred Skills and Qualifications
- Conversant with PCB and Die mechanical layout tools (e.g. Siemens Xpedition, Allegro PCB, Cadence Virtuoso)
- Broad reading in the area of interest and the desire to continue that reading with access to the high quality company library resource, material properties knowledge
- Must be broadly curious and knowledgeable, and willing to pursue mastery of new technical concepts through self-learning or training opportunities available through company resources
- Electrical simulation skills
- Experience using Siemens Fast 3D
- Experience using Siemens Calibre DRV
#LI-CC1 #LI-Hybrid
Export control restrictions based upon applicable laws and regulations would prohibit candidates who are nationals of certain embargoed countries from working in this position without Cirrus Logic first obtaining an export license. Candidates for this role must be able to access technical data without a requirement for an export license. We are unable to sponsor or obtain export licenses for this role.
Cirrus Logic strives to select the best qualified applicant for any opening. Different approaches, ideas and points of view are both valued and respected. Employment decisions are made on the basis of job-related criteria without regard to race, color, religion, sex, national origin, age, protected veteran or disabled status, genetic information, or any other classification protected by applicable law.
Similar Jobs
3D Printing
Design and deliver advanced semiconductor package solutions (FCBGA, SiP, WLCSP, power modules, chiplets). Execute package CAD layout, maintain CAD databases, generate manufacturing outputs, ensure DFM/DFAs and vendor/foundry compliance, and collaborate with SI/PI, thermal, reliability, silicon, and manufacturing teams throughout release cycles.
Top Skills:
Bump MapsCadence Allegro Package DesignerDfaDfmDrcFcbgaGerber/Drill DataLvsNetlistQfnQfpRdlSi/Pi (Signal Integrity/Power Integrity)Siemens Xpedition Substrate IntegratorSipSip LayoutWlcsp
Automotive • Software • Transportation
Lead and scale the accounting function for a fast-growing SaaS company: manage monthly/quarterly/annual close, lead GAAP audits, own revenue recognition, R&D capitalization and purchase accounting, strengthen controls, oversee multi-entity/multi-currency accounting, drive ERP strategy and tax compliance, and manage and develop the accounting team while partnering with finance and executive leadership.
Top Skills:
ErpNetSuite
Cloud • Information Technology • Security • Software • Cybersecurity
Sell Zscaler cloud-native Zero Trust solutions to commercial/private equity accounts. Build C-suite relationships, create long-term account strategies, collaborate with internal teams, act as trusted advisor, and drive net-new logo acquisition and quota attainment through direct and channel selling.
Top Skills:
Cloud-NativeZero Trust ExchangeZscaler
What you need to know about the Colorado Tech Scene
With a business-friendly climate and research universities like CU Boulder and Colorado State, Colorado has made a name for itself as a startup ecosystem. The state boasts a skilled workforce and high quality of life thanks to its affordable housing, vibrant cultural scene and unparalleled opportunities for outdoor recreation. Colorado is also home to the National Renewable Energy Laboratory, helping cement its status as a hub for renewable energy innovation.
Key Facts About Colorado Tech
- Number of Tech Workers: 260,000; 8.5% of overall workforce (2024 CompTIA survey)
- Major Tech Employers: Lockheed Martin, Century Link, Comcast, BAE Systems, Level 3
- Key Industries: Software, artificial intelligence, aerospace, e-commerce, fintech, healthtech
- Funding Landscape: $4.9 billion in VC funding in 2024 (Pitchbook)
- Notable Investors: Access Venture Partners, Ridgeline Ventures, Techstars, Blackhorn Ventures
- Research Centers and Universities: Colorado School of Mines, University of Colorado Boulder, University of Denver, Colorado State University, Mesa Laboratory, Space Science Institute, National Center for Atmospheric Research, National Renewable Energy Laboratory, Gottlieb Institute
