Product Yield Enhancement Engineer, HBM

Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
As a Product Yield Enhancement (PYE) High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer for Micron Technology, Inc., you will work with a team responsible for taking next generation HBM devices from design to mass production!
We focus on failure analysis of test, internal qualification, and RMA failures, allowing for enhanced product reliability, rapid production ramp and early time to market. Our primary areas of responsibility apply fault isolation with a combination of electrical and physical characterization techniques combined with data analysis to identify physical defects introduced by process level or assembly step. You will maintain an in-depth knowledge of HBM technology, testing methodology, assembly technology and fabrication process. Additionally, you will be responsible for presenting and coordinating failure analysis findings with Management, Product, Process, Assembly, and Global Quality teams!
Responsibilities include, but are not limited to, the following:

• Perform Electrical Failure Analysis and Fault Isolation using methods such as emission, laser techniques, and EOTPR.
• Characterize or model backend test, internal qualification, and RMA fail signatures.
• Understand various PFA and de-processing techniques for failures.
• Maintain an in-depth understanding of CMOS/FinFET process fabrication levels, steps, and methodologies.
• Generate organized and timely failure analysis reports with clearly communicated causes and effects.
• Must be available to work either shift, including swing or night shifts, based on business needs.

Qualifications

• Bachelor's degree in Electrical Engineering, Computer Engineering, Physics, or Chemistry, or an equivalent amount of relevant experience.
• 2 to 5 years of demonstrated semiconductor experience in Yield and fault analysis.
• Computer-aided layout and schematic experience.
• Demonstrated knowledge of semiconductor device physics including VLSI design.
• Scripting within a UNIX/Linux environment (Tcl, Bash, SHELL, etc).

Preferred Qualifications

• Master's degree in Electrical Engineering or Material Science.
• Experience performing Fault Isolation and Failure Analysis.
• Extensive understanding of Physical and logical design.
• Understanding of Package Assembly and Fabrication Process.
• Experience in reliability and quality analysis.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
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To learn more about Micron, please visit micron.com/careers
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