A range of experience is needed for numerous openings: including new graduates through industry veterans will be considered for various roles up to and including leadership.
We are leveraging advanced Photonic Integrated Circuits (PICs) to meet the exploding demand for high-speed communication infrastructure. With proven leadership and cutting-edge technology, Nokia is defining the next generation of connectivity solutions. The Optical Module Group within Nokia ON group is seeking talented engineers to develop PIC characterization for both coherent and direct-detection ultra-high-bandwidth data communication systems. In this role, you will:
Collaborate with cross-functional teams, including component design, optical architecture, module development, transmission systems, and SiGe ASIC design.
Drive the development and implementation of high-speed PIC characterization methodologies for next-generation InP-based PICs.
This is a fast-paced environment where innovation and teamwork are key. Be part of a team that is setting new standards in optical technology!
Lead PIC element DC or wide bandwidth RF characterization and develop next generation PIC test infrastructure. Multiple test development positions at different levels in several different focuses are available
Design test plans, develop test methods, and execute performance validation tests.
Interact closely with PIC design, PIC process, SiGe ASIC, and Module design teams for efficient and reliable product releases
Work in Nokia South San Francisco Bay facility
We are looking for an individual with a strong background in optoelectronic device characterization:
Strong fundamental understanding of active and passive semiconductor optical devices, particularly waveguide-based devices
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