Lead and manage a multidisciplinary team in the design and verification of ASICs for EOIR cameras, oversee development activities, and ensure team growth and technological advancements.
Essential Duties:
Lead a multidisciplinary team in successfully characterizing creating developing ASICs for EOIR cameras for R&D prototypes. Serve as the interface with other key business functions. Define and set the standard for all the development activities within the mixed signal design group. Foster a team and expertise comprising a variety of competencies ranging from chip architect and system modelling, analog circuits, high-speed digital, and physical design tailored for yielding large die for operation in extreme environments. This group is responsible for the design, development, and verification of sensor ASICs all the way through camera integration. Line management duties includes supervision of direct reports, career development, and training. They also include identifying metrics to drive improvement, innovation and nurture the best talent, hone the best practices, and lead industry capability. Organizational growth responsibilities include planning, deploying continuous improvement, new capabilities, and maturing and inserting new technologies. Will build a remote team.
Required Skills:
7+ years in technical leadership positions managing multiple teams, projects, helping shape strategic roadmaps for the business. Experience leading multidisciplinary teams and interfacing with the internal and external customers is essential.
Demonstrated track record of success in the aerospace or semiconductor industry in ASIC design.
Strong hands-on experience with one or more of the following areas: ASIC design, Analog or Digital design workflows, chip tape-out, and chip testing and screening workflows.
Familiarity with system modelling techniques, and their screening and characterization under test conditions.
Proficiency in standard productivity tools such as Microsoft Office and comfortable with statistical and scripting software tools. Understanding of design and construction of IR camera sensors and their constituent sub-components as well as their applications and use.
Familiarity with imaging customer’s needs, and the technical barriers to tech insertion and new product adoption.
A demonstrated track record with team building and change management experience in a leadership role.
Special Requirements:
US citizenship and ability to obtain and maintain US Government security clearance
Expected to visit Camarillo facility 1 week every quarter. Additional visitation may be necessary closer to tape-outs.
Compensation:
The base salary range for this full-time position is $182,720 - $234,168 + bonus + benefits.
Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the target for new hire salaries for the position. Individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specifics during the hiring process. Please note that the compensation details listed reflect the base salary only, and do not include potential bonus or benefits.
We are proud to be an EEO/AA employer M/F/D/V. We maintain a drug-free workplace and perform pre-employment substance abuse testing.
Top Skills
Analog Design
Asic Design
Chip Tape-Out
Chip Testing
Digital Design Workflows
MS Office
Scripting Software
Statistical Tools
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