HBM Memory Applications Engineer

Please Note:

1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)

2. If you already have a Candidate Account, please Sign-In before you apply.

Job Description:

Broadcom’s ASIC Product Division (APD) is focused on enabling customers to develop products with a sustainable and substantial competitive advantage.  APD does this by delivering best in class technology platforms, easy to integrate bleeding edge intellectual property, and by providing world class customer support.  APD’s customers span a wide range of industries developing ASICs for largest and most complex cloud computing AI engines, supercomputers, networking, to low power and most advanced wireless solutions as examples.

Job Description:

HBM Memory Applications Engineer.   This role involves working as a highly skilled Applications Engineer providing first class customer support for custom silicon ASIC products that integrate Broadcom’s High Bandwidth Memory (HBM) PHY IP with HBM DRAM memory modules. The successful candidate will work directly with Broadcom’s ASIC customers on their custom silicon products and provide an interface to the DRAM supplier to support resolution of HBM DRAM issues.  This individual must be highly motivated and capable of working independently or as part of a team. Expertise in DDR memory system development and debug is required. Expertise in HBM, DRAM manufacturing test and in-system DRAM test is also desirable. This position is located in Fort Collins, CO.

Education/Experience:

• BSEE and 8+ years relevant experience in DDR memory system design, validation, bring-up and debugging or MSEE plus 6+ years relevant experience in DDR memory system design, validation, bring-up and debugging.

Required Skills:

•      Expert in DDR memory interfaces including the PHY, controller and embedded test capability. Direct experience with HBM memory is a plus.

•      Experience developing DRAM memory tests desired.  Knowledge of different types of memory tests is a must.

•      Understand fundamentals of VLSI IC I/O & control, and built-in self-test (BIST).

•      General knowledge of semiconductor technology and ASIC design flow including Verilog simulation and timing analysis.  Verilog experience is a plus.

•      Experience with state-of-the-art lab test equipment used for evaluating memory interfaces including sampling scopes, real time scopes, function generators and logic analyzers.

•      Extensive programming experience in at least one of the following languages: Ruby (preferred), C, C++, Perl, or Python

•      Strong debugging skills are a must

Additional Requirements:

•      Strong verbal, written communication, and presentation skills.

•      Team player that can easily work with different personalities and skill levels.

•      Ability to multitask and manage multiple technical issues in parallel.

•      Well organized, methodical, and detail oriented.

•      Must develop, accurately track, and meet commitments to product characterization or engineering development schedules.

•      Some minimal travel time may be required.

Typical Duties Include:

•      Develop a detailed understanding of Broadcom's HBM IP, how to control and evaluate the IP, and understand the interplay of the memory performance at the ASIC and system levels.

•      Work directly with Broadcom’s ASIC customers on their custom silicon products during design, bring-up, as well as debugging performance or HBM memory issues.

•      Develop scripts and run characterization shmoos to isolate issues.

•      Design automated bench level device testing procedures by utilizing programmable test equipment and HBM IP built-in test functions.

•      Work closely with the HBM IP design teams to root cause HBM issues.

•      Work with memory suppliers to support resolution of HBM DRAM issues or defects.

•      Work with HBM suppliers as well as Broadcom’s physical analysis teams as necessary to pinpoint failures.

•      Work with memory suppliers, design teams, and Broadcom’s manufacturing teams to define and implement manufacturing test improvements for HBM DRAM or PHY defects.

•      Generate comprehensive test reports with clear analysis methods that highlight the relationships between stimulus / setup conditions and device performance.

Additional Job Description:

Compensation and Benefits

The annual base salary range for this position is $107,000 - $190,000.

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.