Advanced Package Layout Design Engineer, Staff

About Marvell

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities. 

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. 

Your Team, Your Impact

Marvell’s Central Engineering team is seeking a talented High-speed IC package layout design engineer to contribute to the development of advanced microelectronic packages for semiconductors supporting up to 224 Gb/s data rates. The engineer will be responsible for package layout including all signal and power integrity routing while considering manufacturing and assembly tolerances. The engineer will also interface with package suppliers to contribute towards the selection of IC package technology, ensure manufacturability, and compliance with design rules for assembly

What You Can Expect

• Experience with 2.5D package design and development

• Using IC package layout tools like Cadence APD or Mentor XPD

• Understanding IC package design requirements for high speed interfaces and setup constraints manager

• Interface with the IC physical design teams for optimizing the ASIC die floor plan

• Experience in interfacing with Substrate suppliers, OSATs and Silicon fab vendors

• Experience in working with IC package assembly development teams and understanding assembly requirements

• Experience with IC layout tools is highly desired

• Ability to do automation of the layout tasks using scripting

• Power plane design and translating power supply requirements into design

• Familiarity with IC packaging technologies, materials, substrate design rules and assembly rules

• Track record of new product introduction from concept through development and production is a plus

• Knowledge of the thermal and mechanical analysis of the IC package development is a plus

• A team player with strong communication, presentation, and documentation skills

What We're Looking For

• Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 5 - 8 years of related professional experience or Master’s/PhD in Computer Science, Electrical Engineering or related fields with 1-3 years of experience

Expected Base Pay Range (USD)

105,470 - 158,000, $ per annum

The successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefit Elements 

At Marvell, we offer a total compensation package with a base, bonus and equity.Health and financial wellbeing are part of the package. That means flexible time off, 401k, plus a year-end shutdown, floating holidays, paid time off to volunteer. Have a question about our benefits packages - health or financial? Ask your recruiter during the interview process.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at [email protected].

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