Teams at Broadcom

Perform system-level signal and power integrity design, simulation, measurement and debug for high-speed SerDes systems (up to 400G). Collaborate with package, PCB, and silicon teams, develop EM and circuit models, perform VNA/TDR and oscilloscope measurements, correlate measurement-simulation, define SI/PI requirements, and support customer deliverables and documentation.

Lead technical project execution for 20+ concurrent package/PCB designs focusing on high-speed SerDes and high-power delivery. Manage and develop engineers, coordinate customers/vendors, create SI/PI methodologies, support package/PCB technologies, oversee lab measurements and correlations, and drive automation and project management practices.

Execute full-chip physical design from RTL to tape-out, including synthesis, place-and-route, timing closure (top-level STA), clock tree synthesis, EM/IR analysis, floorplanning, physical verification, flow/methodology development, and collaboration with RTL designers. On-site work required in Colorado Springs.